JPH0644147Y2 - 電子部品用放熱体 - Google Patents
電子部品用放熱体Info
- Publication number
- JPH0644147Y2 JPH0644147Y2 JP1987094556U JP9455687U JPH0644147Y2 JP H0644147 Y2 JPH0644147 Y2 JP H0644147Y2 JP 1987094556 U JP1987094556 U JP 1987094556U JP 9455687 U JP9455687 U JP 9455687U JP H0644147 Y2 JPH0644147 Y2 JP H0644147Y2
- Authority
- JP
- Japan
- Prior art keywords
- screw
- hole
- screw hole
- insulating sheet
- radiator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910052751 metal Inorganic materials 0.000 description 14
- 239000002184 metal Substances 0.000 description 14
- 230000005855 radiation Effects 0.000 description 9
- 238000009413 insulation Methods 0.000 description 4
- 230000002093 peripheral effect Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Mounting Components In General For Electric Apparatus (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987094556U JPH0644147Y2 (ja) | 1987-06-22 | 1987-06-22 | 電子部品用放熱体 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987094556U JPH0644147Y2 (ja) | 1987-06-22 | 1987-06-22 | 電子部品用放熱体 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS64385U JPS64385U (en]) | 1989-01-05 |
JPH0644147Y2 true JPH0644147Y2 (ja) | 1994-11-14 |
Family
ID=30958140
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1987094556U Expired - Lifetime JPH0644147Y2 (ja) | 1987-06-22 | 1987-06-22 | 電子部品用放熱体 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0644147Y2 (en]) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100665215B1 (ko) | 2005-06-29 | 2007-01-09 | 삼성전기주식회사 | 전기 부품과 방열 체의 체결 구조 |
JP6003458B2 (ja) * | 2012-09-24 | 2016-10-05 | 株式会社アンセイ | 緩衝部材及び車両用ロック装置 |
WO2018221296A1 (ja) * | 2017-05-30 | 2018-12-06 | 三菱電機株式会社 | 電力変換装置 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5629959U (en]) * | 1979-08-13 | 1981-03-23 | ||
JPS5769243U (en]) * | 1980-10-13 | 1982-04-26 | ||
JPS58109288U (ja) * | 1982-01-18 | 1983-07-25 | 東芝テック株式会社 | 電子部品取付装置 |
JPS58180638U (ja) * | 1982-05-25 | 1983-12-02 | 松下電工株式会社 | 半導体素子の放熱板取付構造 |
-
1987
- 1987-06-22 JP JP1987094556U patent/JPH0644147Y2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPS64385U (en]) | 1989-01-05 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP2001332670A (ja) | 半導体装置の実装構造 | |
JP2638757B2 (ja) | モータドライブ用半導体素子放熱装置 | |
JP3094768B2 (ja) | 半導体装置 | |
JPH0644147Y2 (ja) | 電子部品用放熱体 | |
JPH09283886A (ja) | 基板実装方法及び実装基板構造並びに該実装基板構造を用いた電子機器 | |
JP2951243B2 (ja) | 集積回路のパッケージ | |
US6366446B1 (en) | Aluminum electrolytic capacitor assembly | |
JPH0810203Y2 (ja) | 放熱用クランプ装置 | |
JPH0714684U (ja) | 発熱電子部品の実装構造 | |
JPS5925384B2 (ja) | 電子装置 | |
JPH0445249Y2 (en]) | ||
JPH0316314Y2 (en]) | ||
JP2771746B2 (ja) | 半導体装置 | |
JP2574766Y2 (ja) | 回路基板収納装置 | |
JP3370505B2 (ja) | 電子機器の放熱装置 | |
JP2558396Y2 (ja) | 電子部品の取付構造 | |
JPH0539648Y2 (en]) | ||
JPH09321467A (ja) | 発熱電子部品の放熱構造 | |
JPH0642344Y2 (ja) | 放熱体 | |
JPS6246271Y2 (en]) | ||
JPH0522391B2 (en]) | ||
JP2506808Y2 (ja) | 放熱板用半導体固定装置 | |
JP2597784Y2 (ja) | 電子デバイスの放熱構造 | |
JPH043503Y2 (en]) | ||
JPH0573993U (ja) | 放熱板の取り付け構造 |